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Technology

Total Liquid Immersion with Directed Flow™

TIDF combines direct-to-chip cooling and total immersion inside one sealed, rack-mounted chassis. The coolest fluid reaches the hottest chips first; then it bathes everything else.

How TIDF works

In short: LCS uses single-phase immersion in a liquid-tight chassis, with flow engineered so that the coolest dielectric fluid passes through the hottest components' heatsinks before immersing the rest of the electronics.

Each heatsink is tested and engineered to provide the correct flow so chips run at their intended temperature. After leaving the heatsinks, the fluid gathers the remaining heat from every other component, then exits the chassis to be cooled and returned. LCS describes the coolant as non-toxic and states it never needs replacing.

Liquid carries heat far more effectively than air, LCS cites roughly 1,000 times better, which is what lets a 2U server dissipate up to the published 4 kW without fans.

How Total Liquid Immersion with Directed Flow worksA sealed chassis. Stage 1: cool dielectric fluid enters and is piped directly to heatsinks on the hottest chips. Stage 2: fluid leaves the heatsinks and immerses the remaining electronics. Stage 3: heated fluid exits the chassis to a heat exchanger and returns cooled.SEALED, LIQUID-TIGHT CHASSISCPU/GPUCPU/GPU123Cool fluid inHeated fluid outto heat exchange1 Directed to hottest chips2 Immerses remaining electronics3 Exits, cooled, returns
Illustrative schematic, not to scale and not a drawing of a specific product.
Directed-flow heatsink on a circuit board submerged in dielectric fluid inside an LCS chassis
Inside an LCS chassis: a directed-flow heatsink under fluid.

Comparison

Four distinct ways to cool servers

These approaches are not interchangeable. Qualitative comparison only; performance depends on hardware, configuration, and site conditions.

Comparison of air cooling, cold-plate direct-to-chip, immersion tanks, and LCS rack-based TIDF
AttributeAir coolingCold-plate direct-to-chipImmersion tankLCS rack-based TIDF
Heat carried byAir moved by server fans and room air handlingLiquid through plates on selected chips; remaining components still air-cooledDielectric fluid in an open bath; servers lie horizontallyDielectric fluid in a sealed chassis; directed to hot chips, then immersing everything
Conditioned air still neededYesYes, for components not on cold platesNo for the serversNo for the servers
Server fansYesUsually yesRemovedRemoved (fanless)
Rack formatStandard vertical rackStandard vertical rackHorizontal tankStandard vertical 19″ EIA/OCP rack
ServicingSlide out of rackSlide out; disconnect liquid linesLift server out of the bathDisconnect and slide out of rack
Electronics exposureExposed to room air, dust, humidityExposed to room airSubmerged in open tankSealed inside the chassis

Why LCS chose the rack over the tank

  • Simpler migration from air cooling: chassis insert into EIA and OCP racks.
  • Servers can be added one at a time.
  • Published floor space: 9.5 sq ft per rack vs. 22 sq ft per tank at the same compute density.
  • Published fluid volume: about one-third of a tank system, reducing weight and fluid cost.
  • Servers are removed from the rack for maintenance.
  • Facility water connections from above, as with cold-plate infrastructure; supply water up to 45 °C per LCS.
  • Directed inlet flow enables exit temperatures around 60 °C for heat reuse, per LCS.

Space and fluid comparisons are LCS figures; the reference tank system and configuration are pending confirmation.

A full rack of LCS ZPServers

Questions & answers

Immersion cooling, answered

Glossary

TIDF
Total Liquid Immersion with Directed Flow™, LCS's patented method of directing the coolest fluid to the hottest components and then immersing all remaining electronics in the same sealed chassis.
Single-phase immersion
Immersion cooling in which the fluid stays liquid throughout; it does not boil (two-phase systems rely on boiling and condensing).
Dielectric fluid
A fluid that does not conduct electricity, so energised electronics can be submerged in it.
Direct-to-chip
Cooling that delivers liquid directly to a chip's heatsink or cold plate rather than cooling it with air.
PUE
Power Usage Effectiveness: total facility power divided by IT equipment power. 1.0 is the theoretical ideal. A cooling-only PUE counts only cooling power and is not comparable with whole-facility PUE.
TDP
Thermal Design Power: the heat a processor is designed to dissipate under sustained load, in watts.
EIA / OCP rack
EIA-310 is the standard 19″ rack specification; OCP refers to Open Compute Project rack designs.
Heat exchanger (HEX)
A device that transfers heat from the server fluid loop to water or air without the fluids mixing.
dBA
A-weighted decibels, a sound-level measure adjusted to human hearing.

See also: benefits and how to read each figure · research and field results.

Next step

Let’s solve your cooling challenge.

Tell us about your workload, site, and timeline. An LCS engineer will help you assess whether rack-based immersion fits your infrastructure.