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Harsh Environments

MiniNODE: sealed, immersion-cooled computing for harsh environments

What is the MiniNODE?

The MiniNODE is a compact, sealed industrial computer built around a Mini-ITX motherboard fully immersed in dielectric fluid. Its rugged enclosure carries an IP67 designation, isolating the electronics from dust, water, and corrosive air while liquid removes heat without fans.

LCS MiniNODE sealed immersion-cooled computer beside a monitor and keyboard

Factory floors, processing plants, and outdoor installations expose computers to dust, humidity, salt, and corrosive gases, the most common causes of electronic failure. Sealing an air-cooled PC limits its cooling; venting it lets contaminants in.

The MiniNODE avoids that trade-off. The electronics sit in a sealed enclosure, immersed in a dielectric fluid that carries heat to an external heat exchanger. LCS states that isolating the electronics, damping thermal cycling, and lowering operating temperatures reduces common causes of failure.

Best-fit applications

Industrial control and IIoT
Machine-side computing on manufacturing and process lines.
Dusty, wet, or salty sites
Mining, agriculture, food processing, marine, and coastal environments.
Corrosive atmospheres
Locations where airborne chemicals attack exposed electronics.
Low-maintenance deployments
Places where filters, fans, and air conditioning are impractical to service.

Key capabilities

What the MiniNODE delivers

  • Sealed enclosure with IP67 designation
  • Compatible with Mini-ITX motherboard standards
  • Handles low- to high-power applications
  • No fans, air conditioning, or water required
  • Electronics protected from humidity, dust, oxidation, and corrosive gases
  • Quiet, low-maintenance operation

How it works

Directed flow, then full immersion

  1. 1Using LCS's patented directed-flow technology, the coolest fluid is sent to the hottest component, the processor, first.
  2. 2The fluid then immerses the rest of the board, gathering heat from remaining electronics inside the sealed chassis.
  3. 3Warmed fluid passes to the attached heat exchanger (HEX), is cooled, and returns. The fluid stays sealed inside the system.

Learn more about TIDF

An LCS MiniNODE installed on industrial equipment
Designed to be mounted in industrial settings where conventional PCs struggle.

Technical specifications

LCS MiniNODE specifications

The hardware listed is the published configuration; current components should be confirmed with LCS.

Published configuration: MiniNODE computing hardware as currently published by LCS, subject to confirmation
CPU
  • AMD Ryzen™ 5 5600G-series processor with Radeon™ Graphics
  • 6 cores / 12 threads
  • Base clock 3.9 GHz; max boost up to 4.4 GHz
  • L2 cache 3 MB; L3 cache 16 MB
  • Default TDP 65 W
Memory
  • 32 GB DDR4 2933 MHz
  • 2 × DDR4 SO-DIMM slots (2933 / 2667 / 2400 / 2133)
  • Non-ECC, unbuffered; max system memory 64 GB
Storage
  • Samsung™ 980 1 TB M.2 (up to 3,500 / 3,000 MB/s)
Graphics
  • Integrated AMD Radeon™ (Zen 3)
  • 7 graphics cores; 1900 MHz
LAN
  • PCIe x1 Gigabit LAN, 10/100/1000 Mb/s (Realtek RTL8111GR)
OS support
  • Windows 11 64-bit
  • Windows 10 64-bit
  • RHEL x86 64-bit
  • Ubuntu x86 64-bit
Enclosure, power & cooling: MiniNODE enclosure, power, and cooling specifications
Form factor
  • Thin Mini-ITX, 6.7 in × 6.7 in (17.0 cm × 17.0 cm)
Power supply
  • 180 W / 19 VDC external power brick
Chassis
  • IP67 rugged sealed enclosure protecting electronics from oxidation, corrosion, dust, dirt, salt, humidity, and ESD

Note: IP67 applies to the sealed enclosure. Confirm ratings for external connectors, cabling, and the power brick for your installation.

Dimensions with HEX (W × D × H)
  • 16 in × 18 in × 4.5 in
  • 40.6 cm × 45.7 cm × 11.4 cm
Fluid
  • 1 US gallon (≈3.8 L) single-phase heat-transfer fluid
  • Described by LCS as non-hazardous; does not evaporate or need replacement
Operating temperature
  • 32 °F – 113 °F (0 °C – 45 °C)

Warranty: 1 year parts and labor. Extended warranties are available. Contact LiquidCool Solutions for details.

Deployment & servicing

What to plan for

Mounting
Compact footprint (16 × 18 × 4.5 in with heat exchanger). Allow airflow around the heat exchanger for heat rejection.
Power
External 180 W / 19 VDC brick. The brick is outside the sealed enclosure, plan its location and protection accordingly.
Environment
Published operating range 0 °C – 45 °C. Contact LCS for sites outside that range.
Configuration
LCS is OEM and form-factor agnostic and can configure a system to your application.

Evidence & resources

Go deeper

FAQ

MiniNODE questions

Next step

Computing in a tough environment?

Tell us about your workload, site, and timeline. An LCS engineer will help you assess whether rack-based immersion fits your infrastructure.